Thermexit™ is a line of high-end thermal interface gap filler pads. Thermexit’s™ gap fillers are a non-reactive, non-silicon, no cure system featuring high thermal conductivity and high thermal stability. Thermexit™ produces 2 novel product lines, a High Performance TIM Gap Filler and an Electrically Insulating TIM Gap Filler. Thermexit™ technology is derived from years of government funded research and development in advanced materials including the application of carbon nanotubes in electrochemical systems as well as dispersion, compounding and coating process for composite nanotubes and other carbons.
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