Each year, Nanoramic Laboratories exhibits at the IDTechEx show in Santa Clara, California. IDTechEx brings together over 200 exhibitors from various technology industries, including Energy Storage and Electric Vehicles.
In 2018, Nanoramic exhibited all 3 of our brands at IDTechEx - Neocarbonix, Thermexit and FastCap. The Sales Director of IDTechEx interviewed our CTO, Nicolo Brambilla, and our President & COO, John Cooley to find out more about the advantages of our Neocarbonix electrode technology, Thermexit thermal interface materials (TIMS) and FastCap Ultracapacitors.
Thermexit™ is a line of high-end thermal interface gap filler pads. Thermexit’s™ gap fillers are a non-reactive, non-silicon, no cure system featuring high thermal conductivity and high thermal stability. Thermexit™ produces 2 novel product lines, a High Performance TIM Gap Filler and an Electrically Insulating TIM Gap Filler. Thermexit™ technology is derived from years of government funded research and development in advanced materials including the application of carbon nanotubes in electrochemical systems as well as dispersion, compounding and coating process for composite nanotubes and other carbons.
The Techstars worldwide network helps entrepreneurs succeed. Founded in 2006, Techstars began with three simple ideas—entrepreneurs create a better future for everyone, collaboration drives innovation, and great ideas can come from anywhere. Now we are on a mission to enable every person on the planet to contribute to, and benefit from, the success of entrepreneurs. In addition to operating accelerator programs and venture capital funds, we do this by connecting startups, investors, corporations, and cities to help build thriving startup communities. Techstars has invested in more than 2,500 companies with a combined market cap of more than $209B.